GD32F150G8U6TR is a Replacement parts of
ATSAM3S1BB-MU/ATSAM3S2BA-AU
/ATSAM3S1AB-AU
Mfr.Part No. :
GD32F150G8U6TRManufacturer :
GigaDeviceDescription :
Arm® Cortex®-M3 32-bit MCUPackaging :
REELPackage :
WQFN-28-EP(4x4)Stock :
in stockPrice :
$0.9-$1.3
GD32F150G8U6TR
Price: | $0.9-$1.3 | $2.2-$3.5 |
Replace parts:
Replacement parts:
Alternative parts:
Pin to pin parts:
|
GD32F150G8U6TR |
ATSAM3S1BB-MU
ATSAM3S2BA-AU
ATSAM3S1AB-AU
|
The GD32F150G8U6TR and ATSAM3S1BB-MU are both ARM Cortex-M3 based microcontrollers, providing efficient processing capabilities for embedded applications. The GD32F150G8U6TR operates at a 72 MHz clock speed, while the ATSAM3S1BB-MU is clocked at 48 MHz, offering lower processing power. The higher clock speed of the GD32F150G8U6TR contributes to better performance, especially for applications requiring higher processing speeds, such as sensor control, data acquisition, and communication interfaces.
In terms of memory, the GD32F150G8U6TR offers 128 KB of flash memory and 20 KB of SRAM, while the ATSAM3S1BB-MU provides 128 KB of flash memory and 32 KB of SRAM. While both chips have similar flash memory capacity, the GD32F150G8U6TR provides a slightly more balanced memory architecture with 20 KB of SRAM, allowing better management of data processing and real-time operations in embedded systems.
When it comes to peripherals, the GD32F150G8U6TR offers a rich set of timers, PWM channels, and communication interfaces (including SPI, I2C, and UART), providing flexibility for system designs that need multiple interfaces. The ATSAM3S1BB-MU offers fewer peripheral options, which may limit its applicability in systems requiring diverse I/O capabilities.
In terms of cost, the GD32F150G8U6TR offers a more cost-effective solution while providing higher performance, better peripheral integration, and balanced memory, making it an ideal choice for industrial automation, consumer electronics, and other embedded systems where cost and performance are critical.
The ATSAM3S2BA-AU offers ARM Cortex-M3 processing with a clock speed of 96 MHz, which is higher than the GD32F150G8U6TR's 72 MHz. This difference in clock speed offers the ATSAM3S2BA-AU slightly better computational performance. However, this performance advantage comes at a higher price point, making it less suitable for cost-sensitive applications.
In terms of memory, the ATSAM3S2BA-AU offers 256 KB of flash memory and 64 KB of SRAM, while the GD32F150G8U6TR provides 128 KB of flash memory and 20 KB of SRAM. The ATSAM3S2BA-AU offers more flash memory and SRAM, but for many embedded applications, the memory offered by the GD32F150G8U6TR is more than sufficient. Additionally, the GD32F150G8U6TR is designed to be more cost-effective while still offering rich peripheral support, which can help developers balance performance and cost effectively.
The GD32F150G8U6TR shines in its peripheral integration, providing several I/O interfaces, PWM channels, and timers, ideal for real-time applications. The ATSAM3S2BA-AU, while powerful, is less cost-efficient for many mid-range applications where cost-effective solutions are required.
Thus, for applications that require high peripheral integration and reasonable performance at a competitive price, the GD32F150G8U6TR offers an excellent value, outperforming the ATSAM3S2BA-AU in terms of cost-effectiveness and feature integration.
The ATSAM3S1AB-AU features a 48 MHz clock speed, which is lower than the GD32F150G8U6TR's 72 MHz, offering less computational power. This makes the GD32F150G8U6TR a better option for applications that require higher processing speeds, such as real-time monitoring, sensor control, and complex communication protocols.
Both chips offer 128 KB of flash memory, but the GD32F150G8U6TR provides 20 KB of SRAM, while the ATSAM3S1AB-AU provides 32 KB of SRAM. While the ATSAM3S1AB-AU offers more SRAM, the GD32F150G8U6TR offers better memory balance for handling embedded applications that need to optimize both flash memory and SRAM for different tasks. The GD32F150G8U6TR’s peripheral integration (including more PWM channels, timers, and communication interfaces) also makes it more flexible in a broader range of applications, particularly where multiple interfaces are required.
The GD32F150G8U6TR is also more cost-effective, offering higher performance with comparable memory and better peripheral flexibility at a lower price. This makes the GD32F150G8U6TR a preferred option for developers looking for efficient, cost-effective solutions in embedded designs.
In summary, the GD32F150G8U6TR provides a better combination of processing speed, memory balance, and peripheral flexibility than the ATSAM3S1AB-AU, and at a more competitive price, making it an ideal choice for developers requiring high-performance and cost-effective embedded systems.
In conclusion, the GD32F150G8U6TR offers a superior combination of performance, memory capacity, and peripheral flexibility compared to the ATSAM3S1BB-MU, ATSAM3S2BA-AU, and ATSAM3S1AB-AU. While the ATSAM3S2BA-AU offers higher clock speeds and larger memory, it comes at a much higher price, making the GD32F150G8U6TR a cost-effective alternative for applications requiring balanced performance and rich peripheral integration.
The GD32F150G8U6TR is the best choice for developers seeking high performance at a competitive price, offering superior flexibility, advanced features, and robust peripheral support. It is ideally suited for industrial automation, consumer electronics, sensor systems, and other embedded applications that need reliable performance and cost efficiency.
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