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More than 18 Years of Experience
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Latest News

September 16, 2025
Transaction landing! The world's largest FPGA, independent!
Silver Lake Capital completes acquisition of 51% equity in Altera   Altera, the global leader in FPGA innovation technology, announced that global technology investment giant Silver Lake Capital has completed the acquisition of a 51% stake in Altera, which was previously held by Intel Corporation. At the same time, Intel will retain 49% of Altera's equity, which also demonstrates the confidence of both parties in Altera's future development. The completion of this transaction signifies that Altera has become the world's largest and independent FPGA focused solution provider. By providing the software tools, development kits, IP, and design service resources needed to build a complete FPGA solution, Altera will help customers and partners accelerate innovation. Altera is committed to providing customers and developers with a full stack FPGA product portfolio that features industry-leading architecture, efficient performance, and easy-to-use and scalable software. With Agilex ™ Series products, Altera's advanced FPGA solutions make AI easier to popularize by reducing entry costs while improving performance, reliability, and security. In addition, Altera has a flexible and highly resilient supply chain by collaborating with leading process nodes and OEM partners, allowing global customers to develop products with peace of mind.   Supported by Silver Lake Capital, further enhancing leadership Thanks to operational independence and strategic support from Silver Lake, Altera will significantly enhance its flexibility and resource reserves, accelerate technological innovation, and continue to deliver leading FPGA solutions, while comprehensively enhancing its services and support to global customers and partners. With profound experience in collaborating with management teams to drive the development and transformation of industry-leading semiconductor companies, Silver Lake Capital will assist Altera in accelerating its layout in key areas such as industrial automation, audio and video, robotics, data centers, telecommunications, and edge AI.       I am delighted to collaborate with Silver Lake Capital. This far-reaching strategic investment will not only accelerate our pace of innovation, but also further enhance our leadership in the FPGA market during a critical period when AI applications continue to drive demand growth for programmable logic. In the future, we will focus on optimizing our product portfolio, fully unleashing the innovation potential and talent advantages of our organization, continuously meeting the evolving needs of our customers, and seizing the significant opportunities brought by AI. ——Raghib HussainAltera CEO   At the forefront of FPGA industry and AI evolution, Altera has always held an irreplaceable strategic position. Our investment not only demonstrates our firm confidence in its technological leadership, customer commitment, and long-term growth potential, but also represents our strong support for its future development. We are honored to be able to move forward side by side with Raghib and its outstanding team, opening this new chapter full of opportunities and challenges. ——Kenneth Hao, Chairman and Managing Partner of Silver Lake Capital
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  • September 09, 2025
    Renesas Electronics launches a new USB-C power solution with an innovative three-level topology, which improves performance while reducing system size
    Renesas Electronics (TSE: 6723), a global semiconductor solutions provider, announced today the launch of the RAA489300/RAA489301 high-performance buck controller. This new controller adopts a three-level buck topology structure, designed specifically for battery charging and voltage regulation in USB-C systems. It is suitable for multi port USB-PD chargers, portable power supplies, PC docking stations, robots, drones, and other applications that require high-efficiency DC/DC controllers. The three-level buck converter topology used in this new IC has excellent efficiency and can significantly reduce the inductance required by the buck converter. Its innovative design can minimize power loss and reduce system size, making it an ideal choice for compact high-performance applications. Compared with traditional two-level buck converters, the three-level topology structure adds two additional switches and one flying capacitor. Flyover capacitors can reduce voltage stress on switches, allowing designers to use low-voltage FETs with better quality factors, thereby effectively reducing conduction and switching losses. In addition, this topology structure also supports the use of smaller inductors, with peak to peak ripple of about 25% of that of a two-level converter, thereby reducing inductor core and DC resistance losses. The Renesas USB-PD solution has excellent quality and safety, while also combining high efficiency and power density. As a global supplier of USB-PD solutions, Renesas offers a comprehensive product portfolio covering various applications, including turnkey solutions. With a wide range of development environments and pre certified USB-IF reference designs, we help customers shorten product time to market.   Gaurang Shah, Vice President of the Power Division at Renesas, said: "This three-level buck topology solution is a model of Renesas' outstanding position in the field of battery charging. This innovative technology includes multiple pending breakthrough patent achievements, which can bring significant advantages to our customers compared to competitors' USB-C power solutions. ” The three-level DC-DC RAA489300/RAA489301 voltage regulator has excellent thermal performance, which can reduce cooling requirements and save costs and space. This innovative approach meets the growing market demand for compact and efficient power management systems. The key features of the RAA489300/RAA489301 voltage regulator support a wide range of input and output voltages, and are suitable for integrating safety functions into battery packs and various PD adapters with different voltages; The excellent scalability of the built-in overcharge, overheat, and voltage anomaly protection mechanisms allows for easy adaptation to switch architectures optimized for different power levels and application requirements. Voltage is distributed between power switches to improve efficiency and minimize power consumption, helping to achieve greener and more sustainable designs, reduce thermal stress, enhance system reliability, and extend product life Renesas offers two successful product combinations, RTK-251-SinkCharger-240W and 240W dual port card, which can minimize the development workload required for customers to integrate USB-C battery charging function into their products. These 'successful product combinations' are based on compatible and seamlessly collaborative products, with a technically validated system architecture that brings optimized low-risk designs to accelerate product launch speed. Renesas has launched over 400 "successful product combinations" based on its product lineup, enabling customers to accelerate the design process and bring products to market faster. Renesas Power Management Technology Advantage As a globally renowned supplier of power management products, Renesas Electronics has achieved an average annual shipment volume of over 1.5 billion units in recent years. A large number of these products serve the computing industry, while the rest are widely used in industries, the Internet of Things, data centers, and communication infrastructure. Renesas has the widest portfolio of power management devices, offering unparalleled quality and efficiency, as well as exceptional battery life. Meanwhile, as a trusted supplier, Renesas has decades of experience in power management IC design, backed by a dual source production model, advanced process technology in the industry, and a vast system of over 250 ecosystem partners.
  • September 05, 2025
    Texas Instruments Warning: Tariff Dividend Withdraws, Demand Slows Down!
    Texas Instruments' CFO revealed at an investor conference that the US equivalent tariffs did indeed drive a wave of early customer pickup earlier this year, as orders accelerated growth. However, after the tariff effect receded, the once surging demand cooled down. According to CFO Rafael Lizardi, DeYi's strong performance from January to April this year was partly due to customers placing orders before the tariffs were announced, resulting in a surge in demand. However, after that, demand cooled down. After April, the situation did indeed slow down, at least not growing as usual. Wall Street has been hoping that the analog chip industry can recover, and according to speculation, the industry's revenue has declined by about 25% from its peak. Texas Instruments' profit and revenue performance in the first two quarters of this year were better than expected, but Lizardi's remarks have raised doubts among investors about the prospects for recovery. Mike Beckman, the head of investor relations at Texas Instruments, said, "The impact of tariffs is difficult to separate because there is also a wave of recovery happening at the same time. So, how much each of these factors has played a role?" This is not the first time that Texas Instruments executives have pointed out that demand may have surged significantly. CEO Haviv Ilian said in July that it is reasonable to assume that customers with insufficient inventory may want to increase their stock due to the possibility of tariffs being imposed. (Demand) has normalized in Q2, and our current daily driving factor is mainly cyclical recovery. Texas Instruments' Q2 revenue was $4.45 billion, a year-on-year increase of 16% and a month on month increase of 9%. Q2 operating profit was $1.56 billion, a year-on-year increase of 25%, and analysts expect $1.47 billion. Expected revenue for the third quarter is between 4.45 billion and 4.8 billion US dollars, with analysts expecting 4.57 billion US dollars. Texas Instruments pointed out at the time that some customers had lower than expected demand for analog chips, and four of its five end markets were recovering. Only the automotive market was still hindered by the easing of demand rebound and broader economic uncertainty. According to Barron's Weekly analysis, Texas Instruments' current message to investors is that, apart from the automotive sector, a widespread recovery in overall demand has begun, but it will still take some time to fully grasp the full impact of tariffs. Due to the US's investment in Intel in early August and its consideration of applying this "equity for subsidy" policy to other companies, concerns have arisen about whether it will intervene in the US business world. Chief Financial Officer Rafael Lizardi responded that Texas Instruments has not discussed American investment as a condition for obtaining chip subsidies. :We have not discussed or proposed anything similar. We have also not had any contacts in this regard"

Frequently Asked Questions

Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

Question: What does the warranty policy for your domestic chips cover?

Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

Question: What kind of technical support can I get from you after purchasing your chips?

Answer: Our technical support team consists of experienced engineers who are proficient in chip technology. We offer pre-sales technical consultation to help you select the most suitable chips for your applications. After-sales, we provide assistance in chip integration, debugging, and performance optimization. You can reach out to our technical support hotline or email for any technical issues, and we will respond promptly.

Question: How can I be sure that your domestic chips are compatible with the existing systems and components in my project?
Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.
Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?

Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips
Continental Group collaborates with Novesense to create safer automotive pressure sensor chips   On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips.   In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.
Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1
Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems     The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications.     ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp  
Blog National Technology Invited to Participate in 2024 Intel
Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ®  LOEM Summit November 5-7, 2024, Intel 2024 ®  The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities.   NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields.   NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.

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