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August 29, 2025
Latest market sales of major MLCC enterprises in China, Japan, South Korea, and the United States
In 2024, the global MLCC market shows a steady growth trend, with a market size of approximately 100.6 billion yuan, a year-on-year increase of 5.0%. The booming development of artificial intelligence (AI) has driven the increasing demand for consumer electronic products such as servers, smartphones, and personal computers, which has put higher demands on the usage of MLCC. It is expected that the global MLCC market size will continue to steadily grow to approximately 105 billion yuan by 2025. By 2029, the market size is expected to reach 132.6 billion yuan, with a compound annual growth rate of 5.7% between 2024 and 2029, demonstrating the long-term growth potential of the market. Below we summarize the sales situation of major MLCC enterprises in China, Japan, South Korea, and the United States. The relevant data is evaluated based on the official sales data provided by 2024-2025 and is for reference only. Japanese company 1. Murata: As a leading enterprise in the MLCC industry in Japan and even globally, Murata is in a leading position in technological innovation and market share. The annual sales of various capacitors exceed 40 billion yuan, accounting for more than 50% of the total revenue. Among them, MLCC has the highest global market share, exceeding 30%. Murata, with its profound technical expertise, has started to produce industry-leading 0402 size and 47uF capacity multilayer ceramic capacitors. This product can be widely used in various civilian and high-performance IT equipment, meeting the urgent market demand for miniaturization and high-capacity MLCCs. 2. Solar induced electricity: MLCC's annual sales revenue is approximately 12 billion yuan. The MLCC business of solar induced electricity is gradually growing, and related products can be used in engine ECU and other powertrain systems, achieving a maximum temperature range of 150 ° C, meeting the strict requirements of automotive electronics for stable operation in high-temperature environments. 3. Kyocera: Kyocera has consistently maintained high R&D investment and production scale in its MLCC business. Its products are widely used in multiple fields, and with stable product quality and diversified product lines, it strives to maintain competitiveness in the global MLCC market, occupying a certain market share in communication, industrial control and other fields. TDK: The sales revenue of capacitors is around 12 billion yuan, and its MLCC products have long held an important position in the automotive market, with a market share second only to Murata, accounting for over 70% of the market share, and a higher proportion in higher-level applications. Faced with the rapid changes in the market, TDK actively adjusts its business layout, increases investment in research and development in the automotive market, continuously launches new products that meet the needs of the automotive market, and continues to consolidate its market position in areas such as automotive electronics and AI to cope with fierce industry competition and constantly changing market demands. South Korean company Samsung: Samsung Electric has performed outstandingly in the field of passive components (such as MLCC), with MLCC annual sales exceeding 10 billion yuan, especially occupying the top market share in the consumer electronics sector. Samsung has successfully achieved the micro high capacitance and high voltage resistance characteristics of MLCC through dielectric ceramic powder nano technology. Stable in the global MLCC market. Taiwan, China enterprise 1. Guoju: known as the world's third largest passive parts supplier, the annual sales of MLCC business is about 6 billion yuan. Guoju continues to increase its research and development innovation efforts, launching the embedded CE series MLCC, which can achieve high-frequency circuit integration and meet the demand for high-frequency and high-performance MLCC in emerging fields such as 5G communication and artificial intelligence. 2. Huaxin Technology: Its business is quite extensive, with annual sales of around 8.4 billion yuan, and MLCC is one of its main businesses. The company focuses on research and development investment and actively expands market share. In the fields of consumer electronics, communication, etc., Huaxin Technology's MLCC products have gained recognition from customers for their good cost-effectiveness and stable quality. VISHAY, an American company, focuses on the manufacturing of electronic components and has a unique technology and product layout in the MLCC product line. The annual sales of MLCC are around 3.5 billion yuan. VISHAY's MLCC products have excellent performance and can meet the diverse needs of different customers, and are widely used in industrial, automotive and other fields. With its global R&D and production system, the company is able to quickly respond to market changes and provide customers with high-quality products and services. Chinese Mainland enterprise 1. Fenghua: MLCC's annual sales volume is about 1.8 billion yuan to 2 billion yuan. It is an old brand enterprise and the first MLCC production line in China. Stack over 1000 layers on MLCC products, covering mainstream specifications ranging from 0201 to 2220 sizes. Fenghua High tech actively expands its market, increases research and development investment, improves production capacity and technological level, occupies an important position in the domestic MLCC market, and gradually expands into the international market. 2. Third Ring: MLCC's sales are on par with Fenghua's, and we continue to invest in research and development, committed to improving the performance and quality of MLCC products. Through continuous innovation, the products of Sanhuan Group have gradually gained widespread recognition in the market and their market share continues to expand. The company stands out in the competition of the domestic MLCC market, and its products are not only applied in consumer electronics, communication and other fields, but have also made certain breakthroughs in high-end fields such as automotive electronics. 3. Micro Rong: Through continuous investment in new production capacity, the current sales revenue is around 1.5 billion yuan, with an annual growth rate of over 20%, actively expanding in the automotive MLCC market. The production capacity of microcapacitors has increased from 500 billion pieces in 2018 to around 720 billion pieces today. After the completion of the new factory in 2025, the production capacity is expected to exceed 900 billion pieces, and the plan to reach 1.2 trillion pieces by 2030 is gradually being promoted in an orderly manner. 4. Yuyang: MLCC's annual sales are around 400 million yuan, focusing on the consumer market, especially the smartphone market. Continuously improving technological level, enriching product categories, and striving to enhance competitiveness in the MLCC market. Yuyang's products are applied in multiple fields, gradually expanding their market influence through continuous technological innovation and market expansion, and achieving certain technological advantages in miniaturization and high-capacity MLCC products. 5. Torch Electronics: Continuously cultivating in various capacitor businesses such as military and consumer industries, with annual sales of around 2.8 billion yuan. The company actively expands its market channels, enhances brand awareness and product reliability, and occupies an important position in the domestic MLCC market, especially in high-end fields such as military and aerospace, providing key electronic component support for the development of national defense and high-end manufacturing. 6. Hongyuan Electronics: Annual sales are around 1.8 billion yuan. Focusing on the research and development, production, and sales of MLCC products for military use, continuously optimizing product structure to meet different customer needs. Hongyuan Electronics has won a good reputation in the domestic market with its professional technology and high-quality services in the MLCC field, especially in the military industry where it has a high market share, providing strong support for the development of military electronic equipment in China. 7. Dali Kaipu: With annual sales of around 400 million yuan, it focuses on the research and development of RF microwave MLCC production. With unique technology and product advantages, it gradually stands out in the market. Dali Kaipu continues to improve product performance and market competitiveness, increase research and development investment in high-end MLCC products, strive to break the technological monopoly of international giants, actively layout in emerging fields such as 5G communication and new energy vehicles, and is expected to occupy a place in the global MLCC market. Major enterprises, relying on their technological advantages, market strategies, and innovation capabilities, are fiercely competing in the global market, jointly driving the continuous development of the MLCC industry to meet the growing market demand and emerging application scenarios.
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  • August 25, 2025
    NAND, Suddenly getting cold?
    In the past decade, NAND flash memory has been regarded as a star in the storage industry. Whether it is the popularization of smartphones, the trend of PC replacement, or the rise of cloud computing, NAND has played a crucial role. Its high growth has also driven a global semiconductor industry expansion boom, forming several oligopolistic patterns such as Samsung, SK Hynix, Micron, and Kaixia.             However, since 2024, the industry atmosphere has taken a sharp turn for the worse. NAND prices have experienced drastic fluctuations, putting pressure on corporate profits. Major manufacturers have coincidentally slowed down production expansion or even reduced investment, marking the arrival of a new cycle. At the same time, the rise of AI and high bandwidth memory (HBM) has gradually shifted the market's focus to the DRAM field, redefining the position of NAND in the storage industry landscape. The adjustments made by major giants in NAND research and development production indicate that this industry has shifted from "high-speed expansion" to "cautious investment", and a slow yet intense change is quietly taking place.     The slowdown and transfer of the two giants in South Korea     As a long-term dominant player in the global NAND market, Samsung has been known for its aggressive investments in the past. At this year's International Solid State Circuit Conference, Samsung announced the upcoming release of its V10 (10th generation) NAND flash memory. It is reported that Samsung's V10 NAND flash memory has over 400 active layers and an interface speed of 5.6 GT/s. It also adopts Samsung's exclusive and pioneering Hybrid Bonded Peripheral Unit (CoP) architecture. However, Samsung's V10 NAND mass production journey has not been smooth. It was originally expected to start mass production by the end of this year, but in June, there were reports in South Korea that Samsung was expected to conduct an evaluation of its supply chain composition before the second half of this year, and the actual large-scale production investment may not be carried out until the first half of next year. According to reports, as of June this year, Samsung has not yet finalized its supply chain for NAND core devices, including etching. The reason is that the market demand for high-level stacked NAND is unclear, and the cost-effectiveness issues brought by the introduction of new processes hinder investment promotion. The so-called "etching" refers to the process of removing unwanted substances on a wafer. In the past, when etching channel holes (similar to small holes), it was necessary to perform at a low temperature environment of about -20 ℃ to -30 ℃; But in V10 NAND, it is expected to require an ultra-low temperature environment of -60 ℃ to -70 ℃. The lower the temperature, the weaker the chemical reactivity, and the more precise etching can be achieved without the need for additional protective film. To this end, Samsung Electronics has introduced ultra-low temperature etching equipment from major front-end equipment manufacturers such as Lam Research in the United States and Tokyo Electric (TEL) in Japan, and conducted trial production and quality evaluation. However, the actual evaluation results show that ultra-low temperature etching technology is still difficult to directly apply to mass production. So Samsung is negotiating with Lam Research and TEL to try to conduct equipment evaluation again by increasing some etching temperatures. It is understood that the investment cost brought by the introduction of new devices is also considered one of the important reasons for Samsung's delay in investing in V10 NAND mass production. Samsung still mostly uses Lam Research's equipment in NAND etching processes. If TEL is included in the supply chain, it means diversification of equipment, but at the same time, it will face the problem of decreased usage of existing Lam Research equipment and the need to improve compatibility between the two devices. The difficult production of V10 NAND ultimately affected Samsung's plans for upgrading other production lines. According to South Korean media reports, Samsung Electronics has been promoting conversion investments in the Pingze P1 factory and Xi'an NAND factory since the beginning of this year, with the core being to shift the originally mass-produced 6th and 7th generation NAND to 8th and 9th generations. Compared to fully constructing a new production line, the cost of conversion investment is lower, and partial renovation and continued use of existing equipment result in higher efficiency. However, the conversion investment speed of the most advanced NAND is slowing down recently. Although the 8th generation NAND conversion of P1 factory is proceeding as planned, there have been reports of a delay in the investment for the 9th generation NAND conversion, which was originally scheduled to start as early as the second quarter of this year. The situation at the Xi'an factory is similar. The X1 production line, which is undergoing the 8th generation conversion, is nearing completion, while the X2 production line, which is undergoing the 9th generation conversion, only plans to invest in a monthly scale of 5000 wafers in the third quarter of this year, which is almost the minimum scale required for mass production of memory products. A semiconductor industry insider said, 'Samsung Electronics plans to continue mass producing older generation NAND such as V6 on its X2 production line before the first quarter of next year, and the true implementation of the 9th generation conversion will not take until at least the middle of next year,' explaining that 'this is because the demand for advanced NAND is still sluggish.'. However, Samsung remains cautious about investing in next-generation NAND and related technologies. It had originally considered applying hybrid bonding technology to V9 NAND on the Xi'an X2 production line, but has recently decided to put it on hold. Behind the delay in NAND technology is a lack of market confidence and a reconsideration of capital utilization. Compared to Samsung's high-intensity investment in HBM and DRAM, its conservative attitude in the NAND field is more prominent. Equally lacking in confidence is SK Hynix, which made it clear during the conference call that its NAND business will remain cautious and prioritize profitability. It is worth noting that SK Hynix completed the acquisition of Intel's NAND business this year and is currently restructuring its factory and related assets in Dalian, China. However, the facility investment for its second factory, which began construction about three years ago, is still on hold. Even before acquiring Intel's NAND business, SK Hynix had been discussing building a second factory in Dalian. In 2022, the company held a groundbreaking ceremony in Dalian and announced plans to continue expanding its 3D NAND production capacity in China. The industry initially expected SK Hynix to introduce infrastructure, including cleanrooms, according to its construction plan starting in mid-2023. However, due to geopolitical factors making it difficult to introduce advanced semiconductor manufacturing equipment into China, and the weak performance of the NAND market, the investment plan has been postponed. Korean media pointed out that SK Hynix Dalian Second Factory has not made any equipment investment in the past three years since its foundation. A semiconductor industry insider said, "Although SK Hynix has obtained the 'Certified End User (VEU)' qualification in the United States and investment restrictions in China have been relaxed, the NAND business still faces great uncertainty due to the economic downturn and the entry of newcomers from China. ”He added, "Therefore, there have been no discussions on the specific investment for the new factory in Dalian at present In fact, over the past few years, despite acquiring Intel's NAND business, SK Hynix has still been at a relative disadvantage in this field, and now the AI driven HBM demand has exploded, allowing it to rediscover its core growth points. At present, SK Hynix holds a leading position in the HBM field, almost monopolizing NVIDIA's AI acceleration card supply chain, and its profitability has significantly improved. In contrast, its V10 NAND development progress is relatively lagging behind, and the company has also focused its resources on advanced DRAM and HBM internally. This strategic shift clearly indicates that NAND is gradually being marginalized within SK Hynix and will not be the main investment direction, at least in the short term.   American strategic contraction, Japanese pressure, domestic breakthrough     Micron's actions also confirm the difficulties faced by the NAND industry. In August of this year, Micron announced that due to the continued weak financial performance of mobile NAND products in the market and the slowdown in growth compared to other NAND opportunities, Micron will cease the development of future mobile NAND products globally, including terminating the development of UFS5 (fifth generation universal flash storage). Micron pointed out that this decision only affects global mobile NAND product development work. Micron will continue to develop and support other NAND solutions, including SSD, automotive, and other terminal NAND solutions. At the same time, Micron will continue to support the mobile DRAM market and provide DRAM product combinations. Faced with profit pressure, Micron directly withdrew from competition with Samsung and SK Hynix in the consumer market. The company will shift its focus to the enterprise SSD, automotive, and data center markets, which, although not as large as smartphones, have more stable demand and higher profit margins. At the same time, Micron has significantly increased its research and development, as well as capacity building, in HBM and DRAM, in an attempt to carve out a bigger share of the pie in the AI era. According to its financial report, since the second half of 2024, Micron has continuously raised its revenue and gross profit margin guidance, resulting in significantly better market performance than its NAND business. This differentiation pattern of "NAND sluggish, DRAM strong" reflects Micron's strategy of shrinking NAND to free up resources for future AI memory. Compared to Samsung and Hynix, the situation of Armor Hero is even more difficult. As the world's third-largest NAND supplier, Kaixia has long relied on technology and production capacity cooperation with Western Digital. However, the merger between the two companies, which has been brewing for many years, has yet to materialize, making it difficult for Kaixia to achieve economies of scale that can compete with Korean giants. The lack of scale advantage means that Kaixia is in a passive position in cost control, technological iteration, and market discourse power. At the same time, the drastic fluctuations in NAND prices directly dragged down Kaixia's financial performance, causing its performance to hover on the edge of profit and loss for years. Faced with the pressure of the capital market, Kaixia needs to maintain basic R&D and production investment to maintain competitiveness, but lacks sufficient financial flexibility to promote larger scale expansion or technological upgrades, falling into the dilemma of "unable to advance and unable to retreat". On the other hand, China's Yangtze River storage has chosen to increase investment against the trend and embarked on a differentiated development path. With the support of domestic market demand, Changjiang Storage has been able to maintain its expansion momentum during the global industry's widespread "scale reduction" phase, winning a strategic window for future competition. However, from a global perspective, the NAND market is still dominated by oligopolies, with established manufacturers such as Samsung, SK Hynix, Micron, and Kaixia still firmly controlling most of their production capacity and channel resources. Even though the Yangtze River storage is rapidly catching up, it is difficult to completely shake this structure in the short term. The overall atmosphere remains cautious, with companies placing greater emphasis on risk control and capital returns in investment and expansion, awaiting the arrival of the next growth cycle with clear demand.     The 'cold wave' of equipment manufacturers     The most direct victims of the slowdown in NAND investment are undoubtedly semiconductor equipment manufacturers. In the past few years, local equipment companies in South Korea, such as SEMES (a subsidiary of Samsung), Jusung Engineering, Dongjin Semichem, etc., have relied heavily on Samsung and Hynix's expansion projects to maintain growth. Now, with the two giants delaying the mass production plans of advanced NAND projects, related equipment orders have significantly declined, and cash flow and profitability have been severely impacted. Global device giants have not been spared either. ASML's EUV lithography machines mainly serve the logic and DRAM processes, and their DUV equipment shipments are under pressure during low NAND demand; TEPCO Electronics (TEL) has a high dependence on NAND business in the fields of thin film deposition and etching, and delayed orders directly affect its performance; Applied Materials and Lam Research have felt the most obvious impact in the deposition and etching processes, especially in the demand for ALD, CVD, and high aspect ratio etching equipment for high-level NAND. This has forced both companies to lower their shipment expectations. Kokusai Electric、 Japanese companies such as Hitachi High Tech and SCREEN Semiconductor have also been hit by chain reactions. Faced with this dilemma, equipment manufacturers have to accelerate their "pivot". With the explosive demand for AI driven HBM and high-performance DRAM, as well as the continuous increase in advanced logic processes (3nm/2nm), equipment giants are gradually shifting Jusung Engineering's focus from NAND to logic chips and HBM/DRAM related devices to fill the NAND investment gap. Dongdian Electronics has repeatedly emphasized the stability of its DRAM business in its financial report, while Kelei and Applied Materials are actively promoting the layout of advanced logic and wafer level packaging equipment. At the same time, the popularization of the "conversion investment" model is also changing the industry ecology. More and more wafer fabs are choosing to purchase second-hand equipment and carry out remanufacturing or renovation to extend the service life of the equipment, in order to reduce overall capital expenditures. This trend has driven a rapid rise in the second-hand equipment market, leading to business growth for companies such as Surplus GLOBAL, AG Semiconductor, MTM, and others. However, this has further compressed the market demand for new devices, causing equipment manufacturers that previously relied on large-scale NAND expansion to feel an unprecedented chill in the short term.     NAND, How to break the deadlock     The NAND market entering a downturn is not due to a single reason, but a combination of multiple factors: On the one hand, the global shipment growth of smartphones is sluggish, the PC replacement cycle is prolonged, and the demand for traditional mobile NAND is under long-term pressure. On the other hand, the explosive growth in demand for HBM and DDR5 driven by AI has tilted capital and R&D manpower towards these emerging fields, and NAND is gradually being marginalized. In addition, NAND is also facing capital pressure. Over the past three years, the total investment in the semiconductor industry has reached a historic high, forcing manufacturers to control costs and invest limited resources in businesses with faster returns. Finally, we cannot ignore the technological challenges. Currently, the number of NAND stack layers is approaching the limit of 400, and process difficulty, yield issues, and cost control have become bottlenecks, greatly increasing investment risks. In the foreseeable future, the NAND market will continue to maintain a low speed, investment will be cautious, and manufacturers will allocate more resources to DRAM and HBM. However, in the medium term, with the popularity of AI training, edge computing, high-capacity SSDs and other scenarios, NAND may rediscover growth opportunities. For example, in the storage systems required for future generative AI, high-capacity and low-cost NAND may have unique value. Of course, NAND manufacturers are also looking for breakthrough opportunities like HBM, such as the recent collaboration between Sandisk and SK Hynix aimed at standardizing "high bandwidth flash" (HBF). HBF is a memory technology based on NAND flash memory, built into a package similar to HBM. This marks the first solid step in the industry towards integrating flash memory and DRAM like bandwidth into a single stack, with the potential to fundamentally change the way AI models access and process data on a large scale. But in the long run, the dual breakthroughs in technology and market will truly determine whether the NAND industry can reach the next turning point. On the one hand, new processes such as hybrid bonding and>400 layer stacking need to mature in order to achieve a qualitative leap; On the other hand, new application bursts must emerge on the demand side in order to free NAND from the fate of marginalization. Otherwise, this former 'star storage' is likely to continue hovering on the edge of the industry.
  • August 20, 2025
    Suddenly! Japanese consortium invests heavily in Intel!
    On August 19th, Intel Corporation and Japan's SoftBank Group announced that SoftBank will invest $2 billion (approximately 14.376 billion yuan) in Intel! According to the agreement, SoftBank will purchase Intel's common stock at a price of $23 per share. Affected by this news, Intel's stock rose 4% in after hours trading. This investment is seen as an important vote of confidence in Intel. In recent years, Intel has failed to fully seize the opportunities brought by the artificial intelligence boom in the advanced semiconductor field, resulting in poor stock price performance. In 2024, Intel's stock price fell by 60%, marking the worst annual performance since the company went public more than half a century ago. However, as of the close of this Monday, Intel's stock price has risen by 18% in 2025. Intel, as the only company in the United States capable of producing the most advanced chips, holds a crucial position in the US semiconductor supply chain. Recently, Intel has become a focus of discussion in the Washington political arena as the company is seen as a key chip supplier to the United States. However, Intel's foundry chip manufacturing business has not yet received significant customer orders, which is crucial for the stability and expansion of its business. Last month, Intel stated that it would further invest in its foundry business after receiving customer orders. At the industry level, the arrival of this funding coincides with Intel's critical transformation period. According to the second quarter financial report, Intel achieved revenue of $12.9 billion, which was basically the same as the same period last year, but suffered a net loss of approximately $2.9 billion due to restructuring, impairment, and one-time costs. To alleviate pressure, the company's management is reducing operating expenses while continuously promoting organizational streamlining, and is shifting space for wafer foundry manufacturing, chip products, and AI routes through a "cost reduction+focus" approach. Currently, the progress of capital expenditures, customer commitments, and manufacturing outsourcing business has become an important signal for the outside world to observe Intel's future trends. However, in the fiercely competitive semiconductor industry, relying solely on financial subsidies or cost control is not enough to reverse the situation. What is more crucial is technological iteration and gaining more customers. Especially Intel's decision to continue investing in its wafer foundry business (IFS) is crucial in identifying key customers and long-term foundry orders. This is related to whether the utilization rate and gross profit margin of the production line can be improved, thereby establishing a sustainable business path and forming a positive cycle for the subsequent research and mass production of nodes such as 14A/18A. SoftBank's investment has also sparked speculation in the market about the potential synergy between Arm, a subsidiary of SoftBank, and Intel. Intel is promoting its foundry business, hoping to provide wafer manufacturing services to more chip customers. If the two can collaborate, Arm's IP ecosystem and Intel's manufacturing capabilities may complement each other.

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Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips
Continental Group collaborates with Novesense to create safer automotive pressure sensor chips   On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips.   In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.
Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1
Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems     The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications.     ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp  
Blog National Technology Invited to Participate in 2024 Intel
Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ®  LOEM Summit November 5-7, 2024, Intel 2024 ®  The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities.   NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields.   NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.

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