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December 23, 2025
A Japanese company selling cloth got stuck with an AI chip
Nittobo, a Japanese company that originated in the textile industry, has ventured into the research and development of T-Glass, a key material for AI chip packaging. This material is crucial for the stable operation of high-end chips. Nittobo monopolizes 90% of the global high-end fiberglass cloth market, with no competitors in the T-Glass field. With the explosive growth in AI demand, the material is in short supply, creating a supply gap. This "cloth-selling company" has thus secured a crucial link in the global AI chip industry. Today, let's learn about Nittobo:   I. A Century of Transformation: From Textile Mill to AI Material Giant Nittobo's history can be traced back to a textile company founded in 1898. Officially established in 1923, it is one of Japan's oldest silk textile companies. In its early years, it relied on surplus electricity from irrigation canals built by the Meiji government, generating electricity while simultaneously producing textiles, focusing solely on textile-related products until 1963. 1969 was a crucial turning point. With the rise of computer and chip technology, the company targeted market demand and ventured into the field of glass cloth for printed circuit boards. After decades of dedicated development, Nittobo has transformed from a traditional textile factory into a leading supplier of core AI materials, achieving a remarkable industrial upgrade.   II. Flagship Product T-Glass: The "Stable Cornerstone" of AI Chips Nittobo's core competitiveness stems from its T-Glass material, launched in 1984. Simply put, T-Glass is a high-performance glass fiber cloth, characterized by its high strength and minimal expansion under heat. Initially used in composite materials, it was later found to be particularly suitable for the electronics field—AI servers and high-end smartphone chip packaging substrates all rely on it. Chips generate heat during operation, and ordinary materials are prone to deformation and warping, while T-Glass effectively solves this problem, ensuring high-speed computing and long-term stable operation of chips, making it a key material for high-end chip packaging.   III. Market Monopoly: The "Hidden Hegemon" of High-End Global Glass Fiber Cloth In the high-end glass fiber cloth sector, Nittobo holds a near-monopoly. With only a handful of manufacturers worldwide capable of producing high-end NE glass fiber yarn, Nittobo alone controls 90% of the global high-end glass fiber cloth market share. Especially T-Glass, specifically designed for high-end ABF substrates, is unmatched by Nittobauer in this field. With the explosive growth in demand for AI servers, T-Glass is in short supply, even causing a shortage in BT substrates used in mobile phone chips. Goldman Sachs predicts a double-digit percentage shortage of T-Glass for BT substrates in the coming quarters.   IV. Industry Impact: The "Pricing Power Controller" Behind the Price Hike As an industry leader, Nittobauer's moves directly impact the global supply chain. In June 2025, Nittobauer announced a 20% price increase for glass fiber starting in August, triggering a chain reaction across the industry. This is driven by the explosive growth in AI demand—a single AI server requires 5-8 times more high-end glass fiber cloth than a regular server, while overseas manufacturers like Nittobauer have adopted a conservative approach to capacity expansion, leading to supply shortages. Currently, global demand for low-dielectric electronic cloth continues to rise, and Nittobauer's production capacity and pricing strategy directly affect the costs and supply cycles of downstream industries such as PCB and chip packaging.
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  • December 21, 2025
    The world's first 2nm chip: officially released
    Samsung Exynos 2600 Heavy Release: 2nm 1、 On Friday, Samsung Electronics dropped a bombshell in the mobile semiconductor industry and officially announced the complete details of the industry's first 2-nanometer process smartphone application processor, Exynos 2600. This chip, which carries Samsung's top semiconductor strength, not only marks the official entry of mobile chips into the 2nm new era, but also relies on the surround gate (GAA) architecture as the cornerstone, in terms of performance AI、 Disruptive breakthroughs have been achieved in the four dimensions of imaging and heat dissipation, redefining the technological ceiling of flagship mobile computing cores. As the "super brain" of smartphones, the Exynos 2600 is built by Samsung's LSI department, with precision manufacturing of the GAA architecture guaranteed by the OEM factory, which will directly empower the Galaxy S26 series flagship models to be released early next year. The 10 core CPU configuration based on the latest Arm architecture is luxurious: led by one 3.8GHz Cortex-C1 Ultra super core, paired with three 3.25GHz Cortex-C1 Pro performance cores and six 2.75GHz Cortex-C1 Pro energy efficiency cores, forming a golden combination of "ultra-high performance+balanced energy efficiency", with overall computing performance skyrocketing by 39% compared to the previous generation. Significant improvement in AI and graphics performance: the integration of a 32K MAC NPU AI engine doubles the performance of generative AI workloads; With the support of Samsung Xclipse 960 GPU, the graphics performance has skyrocketed by 100% compared to Exynos 2500. Coupled with Kinetic Reality technology, ray tracing performance has been improved by 50%. Exynos Neural Super Sampling frame generation technology enables game smoothness to exceed 300%, achieving a console level experience. Full imaging capability: single camera supports up to 320 million pixel CMOS and 108MP@30fps Continuous shooting, dual camera 64MP+32MP to meet professional needs; Top display and encoding/decoding capabilities, supporting 4K/ WQUXGA@120Hz High refresh rate, 8K codec, integrated full format codec covering audio and video scenes. The core highlight is that the Exynos 2600 has implanted a heat dissipation path module (HPB) in a mobile SoC for the first time, using high dielectric constant materials to reduce thermal resistance by up to 16%, solving the pain point of high-end chip heat dissipation. At the same time, as the first 2nm GAA smartphone chip, it is the first to support hybrid quantum encryption to ensure security, and will become the foundation platform for future Exynos chips, laying a technological advantage. 2、 Samsung's mobile phone strategy: Half of the S26 models are equipped with Exynos 2600 for mass production, which is not only a technological breakthrough, but also a heavyweight signal for Samsung to revive its self-developed mobile processor strategy. According to a previous report by the Korea Economic Daily, Samsung plans to equip about half of its Galaxy S26 series models with this chip, which is a radical counterattack measure after its self-developed chip suffered setbacks. According to the plan, the entire Galaxy S26 series (including Ultra version) in the Korean and European markets will be equipped with Exynos 2600, while Qualcomm Snapdragon will still be used in the US, Japan, and China markets. This balanced distribution means that Samsung has deployed Exynos chips on a large scale in its flagship Galaxy series for the first time since 2021, marking a comprehensive return to its self-developed strategy. Looking back at history, Samsung's flagship Galaxy used Exynos chips before 2015, but switched to Qualcomm in 2016. The heat dissipation issue and low yield of the 2022 Galaxy S22 series Exynos chip have dampened consumer confidence and accelerated the transition. Since last year, Samsung has launched a self-developed comeback: the Galaxy S24 Basic/Plus version is equipped with Exynos 2400, and the subsequent Galaxy Z Flip7 (sold only in Korea) is equipped with Exynos 2500, gradually rebuilding trust. The mass production and large-scale adoption of Exynos 2600 is a crucial step for Samsung's return to self-developed technology. This reflects its confidence in its semiconductor capabilities and is also an important measure to restructure the mobile chip market landscape. With its first mover advantage in 2nm technology, Samsung is attempting to regain the voice of high-end mobile chips and reverse its passive situation. As the Galaxy S26 approaches, this direct confrontation with Qualcomm will become the biggest highlight of the high-end mobile phone market in 2025.
  • December 17, 2025
    Just now! Kingston Warning!
    "It’s bad, and it’s getting worse right now."   SSDs will continue to rise, with the upward trend running through the entire year of 2026. According to TomsHardware, Cameron Crandell, SSD Business Manager at Kingston Data Centers, warns that the shortage of NAND Flash may worsen within 30 days, directly driving up SSD prices. He also predicts that memory and SSD prices will rise throughout 2026. Crandell, who has 29 years of experience in Kingston, said that the storage price increase this time is "unprecedented". He suggested that consumers with storage upgrade needs should take immediate action and not wait and see. The industry points out that NAND Flash, which accounts for 90% of the material cost of traditional SSDs, has price fluctuations as the core influencing factor of terminal prices.   Since the beginning of this year, NAND Flash has skyrocketed, and cost pressure has been transmitted to the end market. Enterprise grade SSDs have entered a stage where both quantity and price have risen. The latest survey by global market research firm TrendForce Consulting shows that the overall atmosphere of the storage market in the fourth quarter of 2024 has shifted from "recovery" to "material grabbing". The core reason is that after experiencing previous market cycle fluctuations, NAND Flash suppliers generally adopt a cautious strategy for capacity expansion, resulting in a much lower growth rate of enterprise SSD capacity than the market demand growth rate.   The outbreak of the AI industry is the key driving force behind the supply-demand imbalance in the storage market. For core buyers such as cloud service providers (CSPs), an active inventory reserve plan has been launched recently to avoid delays in the costly AI server construction schedule due to SSD shortages. In this supply-demand pattern, Jibang Consulting predicts that the average contract price of enterprise SSDs in the fourth quarter will achieve a quarterly increase of over 25%, and the overall revenue of related industries is expected to reach a historical high. It is worth noting that the price surge in the storage market is not limited to the SSD field. According to media reports, driven indirectly by the demand for AI, the price of traditional HDD (mechanical hard disk) has also increased. Industry insiders point out that the current storage shortage has surpassed the scope of a single NAND Flash chip and evolved into a comprehensive impact on all available storage devices in the market. The entire storage industry is facing a global supply-demand imbalance challenge.

Frequently Asked Questions

Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

Question: What does the warranty policy for your domestic chips cover?

Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

Question: What kind of technical support can I get from you after purchasing your chips?

Answer: Our technical support team consists of experienced engineers who are proficient in chip technology. We offer pre-sales technical consultation to help you select the most suitable chips for your applications. After-sales, we provide assistance in chip integration, debugging, and performance optimization. You can reach out to our technical support hotline or email for any technical issues, and we will respond promptly.

Question: How can I be sure that your domestic chips are compatible with the existing systems and components in my project?
Answer: Our domestic chips are designed with broad compatibility in mind. Before you make a purchase, our technical team can offer in-depth consultations. We will analyze your specific system requirements, including interface types, power consumption, and operating frequencies, and then recommend the most suitable chips. Additionally, we have a library of technical documentation and case studies that showcase successful integrations with a wide range of systems and components, which can help you assess compatibility.
Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?

Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog Continental Group collaborates with Novesense to create safer automotive pressure sensor chips
Continental Group collaborates with Novesense to create safer automotive pressure sensor chips   On October 24, 2024, the 2024 Continental China Experience Day, hosted by Continental Group, was held in Gaoyou City, Jiangsu Province. Nearly 200 guests from the upstream and downstream of the automotive industry chain were invited to attend the conference and engage in in-depth dialogue on the collaborative development and future trends of the automotive industry, jointly exploring future market forms and opportunities. Wang Shengyang, founder, chairman, and CEO of Novosense, and Dr. Zhao Jia, director of Novosense Sensor Product Line, were invited to attend. During the event, Novosense and Continental Group announced a strategic partnership to jointly develop automotive pressure sensor chips.   In this collaboration, both parties will focus on jointly developing automotive grade pressure sensor chips with functional safety features. The newly developed pressure sensor chip will be based on Continental's next-generation global platform, with a focus on improving reliability and accuracy. It can be used to achieve safer and more reliable systems for automotive airbags, side collision monitoring, and battery pack collision monitoring.
Blog ovosense micro car specification level 4/8-way half bridge drive NSD360x-Q1
Novosense micro car specification level 4/8-way half bridge drive NSD360x-Q1: multi load compatibility, enhancing the flexibility of automotive domain control systems     The Novosense NSD3604/8-Q1 series multi-channel half bridge gate driver chip covers 4/8 half bridge drivers and can drive at least 4 DC brushed motors, achieving multi-channel high current motor driving. It can also be used as a multi-channel high side switch driver. Very suitable for multi motor or multi load applications, such as car window lifting, electric seats, door locks, electric tailgates, and proportional valves for body control applications.     ◆ Wide operating voltage: 4.9V-37V (maximum 40V) ◆ 4, 8-channel half bridge gate drive ◆ Configurable timing charge discharge current drive (CCPD), optimized EMC performance ◆ Integrated 2-level charge pump for 100% PWM ◆ Integrated 2-channel programmable wide mode op amp  
Blog National Technology Invited to Participate in 2024 Intel
Draw a blueprint together! National Technology Invited to Participate in 2024 Intel ®  LOEM Summit November 5-7, 2024, Intel 2024 ®  The LOEM Summit was grandly held in Bangkok, Thailand, and National Technology Co., Ltd. (hereinafter referred to as "National Technology"), as Intel's global partner, was invited to participate in the summit. This summit provides an important platform for 200 Intel business partners from around the world to enhance communication and connection, share development experiences, and actively explore new opportunities in the future. Taking this opportunity, National Technology showcased its fourth generation trusted computing chip NS350, high-precision metering battery management chip NB401, and related application cases at the summit, showcasing its product capabilities.   NS350 is the fourth generation trusted computing chip of National Technology, which has advantages such as high security, high performance, and great value. It is designed based on 40nm process, supports I2C and SPI interfaces, and provides packaging forms such as QFN32 and QFN16. It complies with China's TCM2.0 trusted password module standard (GM/T 0012-2020) and the international TPM2.0 (Spec 1.59) trusted computing standard. The chip has passed the CC security function testing and security assurance assessment by the international third-party authoritative testing agency THALES/CNES, and has obtained the CC EAL4+certification certificate issued by the French National Agency for Information Systems Security (ANSSI). The chip is compatible with international mainstream operating systems such as Windows, Linux, BSD UNIX, as well as domestic operating systems such as Galaxy Kirin, Tongxin, Fangde, and Shenzhou NetEase Government Edition Windows. It can be used in fields such as PC, server platforms, and embedded systems to protect information system security and effectively resist various attacks from the network. The national technology collaborative negative electrode material business develops electrochemical battery measurement algorithms, with core technological advantages supporting battery safety measurement and industry-leading high-precision SOC measurement algorithms. It provides AFE, MCU, BMS, and algorithm overall solutions for the consumer, industrial, and automotive electronics fields.   NB401 is a high-precision metering battery management chip launched by National Technology for the consumer market. The product integrates a high-precision power calculation method and has multiple functions such as battery monitoring, metering, protection, and certification. It can support the management and metering of 2-4 series of lithium-ion batteries or lithium polymer batteries. The chip integrates two 16 bit high-precision ADCs for voltage (or temperature) and current acquisition, as well as hardware protection and wake-up functions. It supports SMBus communication, intelligent charging management, and multiple safety certifications, with ultra-low power consumption characteristics, which can meet the needs of most battery management or metering applications in the consumer electronics field. It is suitable for battery pack applications in electronic devices such as laptops, tablets, mobile phones, cameras, drones, power tools, and power banks.

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