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September 02, 2026

Nvidia announces investment in MediaTek for 23.5 billion!

The two companies announced in a joint statement on Monday that Nvidia will purchase bonds convertible into MediaTek stock. This investment expands the cooperation between two chip design companies. According to the agreement, MediaTek will use Nvidia's NVLink Fusion and newly released NVHBM technology as part of its technology suite to help facilitate smoother communication between data center components. This smaller company is attempting to challenge Broadcom and Marvel Technologies by helping data center owners create their own components. For Nvidia, this new agreement is its latest move to ensure that the future of artificial intelligence is built around its hardware platform and standards. The company has been building data center interconnect systems, such as NVLink Fusion, and collaborating with companies like MediaTek to ensure its core position throughout the entire hardware chain, not just limited to its leading AI accelerators. Previously, Amazon also announced a similar agreement, agreeing to deploy an additional 2 million Nvidia components. More importantly, Amazon has also promised to use Nvidia's connectivity technology in its self-developed chips. Nvidia CEO Huang Renxun, born in Taiwan, is strengthening ties with a company committed to reducing its dependence on the smartphone market. Earlier this year, MediaTek partnered with Google, a subsidiary of Alphabet, and gained increasing recognition as a design partner for a large technology company seeking to build its own AI chips. This development momentum has led to a nearly two-fold increase in the market value of this chip manufacturer in recent months. The agreements with MediaTek and Amazon give Nvidia the opportunity to maintain its core position in the construction of artificial intelligence data centers, even as the company deploys chips aimed at replacing its main products. This transaction once again demonstrates Nvidia's investment as an industry leader in customers, competitors, and other AI related enterprises. Despite Nvidia's strong denial that it is creating false demand, there are still concerns among investors about these seemingly cyclical investments. The management of the company stated that the huge investment is just another way to accelerate the popularization of its technology and will drive the development of the artificial intelligence industry. Nvidia remains a major beneficiary of significant investments by some of the world's largest companies in artificial intelligence data centers. Its acceleration chip derived from graphics processors performs well in creating and running artificial intelligence tools and services. With this advantage, Nvidia is constantly developing other technologies including complete computers and networks. Nvidia's leading position has attracted numerous potential competitors and prompted its largest customers, including Amazon, Google, and Microsoft, to increase their internal chip research and development efforts. At present, Nvidia's dominant position remains solid: the company predicts a significant increase of 70% in sales next year. MediaTek has partnered with Nvidia to help this American chip manufacturer enter the laptop market. This Taiwanese company is assisting Nvidia in developing RTX Spark products for this market. MediaTek also stated that it plans to actively recruit talents to better seize the business opportunities brought by the artificial intelligence boom. The company expects revenue from artificial intelligence chips to reach approximately $2 billion this year and has set a goal of occupying 15% of the $80 billion data center market next year. NVIDIA and MediaTek deepen long-term partnership to jointly build an artificial intelligence platform from edge to cloud computing NVIDIA and MediaTek announced today the deepening of their long-term cooperation to jointly build the next generation of artificial intelligence computing platforms, covering areas such as artificial intelligence infrastructure, local artificial intelligence computing, and automotive applications. As part of this collaboration expansion, MediaTek will adopt NVIDIA NVLink Fusion ™ The platform provides a pre validation path for ultra large scale data centers, cloud service providers, and cutting-edge model developers to develop customized XPUs and integrate them into NVIDIA NVLink ™ Connected rack mounted artificial intelligence factories. Both parties will combine NVIDIA's accelerated computing, artificial intelligence, graphics, and software platforms with MediaTek's leading advantages in custom chips, high-performance computing, energy-efficient System on Chip (SoC) design, advanced packaging, interconnect, and connectivity technologies. NVIDIA also invested $3.5 billion to purchase convertible bonds issued by MediaTek. NVIDIA and MediaTek are collaborating in three major areas: Artificial Intelligence Infrastructure: MediaTek will collaborate with NVIDIA's NVLink Fusion ecosystem to help customers develop customized AI infrastructure for integration with NVIDIA rack level systems and AI factories. Local Artificial Intelligence Computing: Both parties will continue to collaborate on the development of multiple generations of NVIDIA RTX Spark ™ DGX Spark ™ PC chips integrate NVIDIA GPUs with MediaTek SoCs to power consumer PCs, artificial intelligence developer supercomputers, and enterprise workstations. In the automotive field, MediaTek and NVIDIA will continue to develop software defined automotive platforms driven by artificial intelligence to welcome the arrival of the era of physical artificial intelligence. Artificial intelligence is changing every computing platform - from the world's largest artificial intelligence factory to personal computers and cars, "said Huang Renxun, founder and CEO of NVIDIA. MediaTek is one of the world's leading semiconductor companies with extraordinary expertise in system on chip design, connectivity, superior performance, and energy efficiency. We will work together to build a platform that brings NVIDIA's accelerated computing to new markets and allows customers to freely create differentiated AI systems on a large scale. ” MediaTek and NVIDIA share a common vision of popularizing advanced AI computing across the entire technology field, "said Cai Lixing, Vice Chairman and CEO of MediaTek. NVIDIA's investment strengthens our collaboration in the automotive industry in the era of cloud AI infrastructure, local AI computing, and physical AI. By combining NVIDIA's leading position in accelerating computing and AI software ecosystems with MediaTek's expertise in a diverse AI technology portfolio from edge to cloud, and our leading position in custom chips, we can accelerate customer innovation. ” Building customized AI infrastructure using NVLink Fusion platform MediaTek will provide the NVLink Fusion platform as the design foundation for custom AI accelerators developed by customers, enabling their platform to develop in sync with future NVIDIA architectures. The NVLink Fusion platform provides a pre built, pre certified, and system pre validated infrastructure for multi chip XPU development, accelerating the development process from chip and advanced packaging to rack level systems. The NVLink Fusion platform integrates key technologies for customized XPUs, including: The NVIDIA NVLink Fusion chipset utilizes NVIDIA photon or electrical interconnect technology to connect XPUs to the NVIDIA NVLink expansion architecture. NVIDIA NVLink-C2C， Provide high bandwidth, energy-efficient connections between XPU, NVIDIA Rosa CPU, and other compatible processors. NVIDIA NVHBM， Integrate customized memory functionality to increase bandwidth and energy efficiency while allocating more chip area for computing. Building custom accelerators is just the beginning of deploying custom XPUs in rack level AI factories. Integrating multi chip architecture, advanced packaging, high-speed SerDes, HBM, I/O, and scalable networks into a manufacturable and mass-produced system requires extensive engineering design, certification, and supply chain support from chip to rack. Customers do not need to design and certify every component of custom XPU from scratch, but can focus their resources on defining the differentiated computing capabilities of their platform, while relying on NVLink connectivity, memory architecture, packaging, manufacturing, and rack level technologies provided by NVIDIA and MediaTek to achieve production deployment. Customers can submit their XPU designs to MediaTek and customize connectivity, memory, packaging, performance, and power characteristics based on their workload and infrastructure requirements. In addition, MediaTek is also part of the broader NVIDIA NVLink Fusion ecosystem, which enables hyperscale data centers, cloud service providers, and cutting-edge model developers to seamlessly connect custom XPUs to NVIDIA's AI infrastructure. With NVLink Fusion, partners can leverage NVIDIA's mature vertical and horizontal scaling technology stack and ecosystem, as well as NVIDIA MGX ™ Rack level architecture reduces development complexity, improves performance, and accelerates the time to market for semi custom AI factories. Introducing supercomputers into local AI computing NVIDIA and MediaTek are working together to advance local AI computing to embrace the era of generative and intelligent AI. Both parties will combine NVIDIA's leading position in accelerated computing with MediaTek's expertise in high-performance, energy-efficient system level chip design. MediaTek has collaborated with NVIDIA to develop the GB10 Grace Blackwell supercomputer, which powers the NVIDIA DGX Spark. The NVIDIA DGX Spark integrates NVIDIA Blackwell GPU and Grace CPU, and is connected through NVLink-C2C to bring powerful AI capabilities to edge systems. The two companies have expanded their collaboration to NVIDIA RTX Spark, aiming to power the next generation of consumer PCs for the AI era. Advancing the development of AI defined cars in the era of physical AI. In addition, NVIDIA and MediaTek are collaborating across multiple generations to advance the development of AI driven software defined cars. Both parties will leverage MediaTek's leading position in automotive system level chip design and NVIDIA's expertise in accelerating computing AI、 Combining advantages in graphics and software. The MediaTek Dimensity automatic platform integrates NVIDIA technology, providing advanced AI and NVIDIA RTX for intelligent car cockpits ™ Graphics processing capability and compatible with NVIDIA DRIVE AGX ™ Collaborative work. The two companies will continue to build scalable architectures for future generations of products based on this foundation to support increasingly intelligent AI vehicles.

August 10, 2026
SK Hynix invests 256.6 billion won to expand production
On August 7, SK Hynix announced plans to invest 54 trillion won (approximately 256.63 billion yuan) to expand its chip factories in South Korea. The company stated that it is building new chip factories in Yongin and Cheongju, South Korea, to meet the "growing demand for memory chips in the age of artificial intelligence." Market research firm Omdia predicts that demand for DRAM and NAND will maintain a compound annual growth rate (CAGR) of 19% from last year to 2030. Omdia believes this growth is not a temporary supercycle, but a structural transformation, where memory will transcend its role as a simple component and become a core infrastructure determining the performance of artificial intelligence. SK Hynix pointed out that in the AI era, technological competitiveness alone is insufficient to maintain an advantage; the ability to deliver sufficient quantities of products at the time customers require is the true competitive advantage. This investment decision was made after a thorough assessment of market demand. The company stated that Yongin Y2 is the second of four wafer fabs being built sequentially within the Yongin Semiconductor Cluster, with a total construction area of approximately 341,000 pyeong (approximately 1.13 million square meters). It will be operational as a DRAM production base. The project is scheduled to commence construction in July next year, with the first cleanroom expected to open in June 2029, primarily producing next-generation DRAM products such as HBM. Currently, the Y1 wafer fab construction is progressing smoothly, with the first cleanroom expected to open in February next year. With the accelerated popularization of AI services, NAND flash memory demand is rapidly growing, primarily driven by enterprise-grade solid-state drives (eSSDs). Simultaneously, the demand for key-value caching in AI inference processes is further increasing, coupled with the gradual implementation of agentic and physical AI applications, the application scenarios for NAND flash memory are expected to expand further. SK Hynix stated that the company chose to build its new NAND flash memory production base in Cheongju because it can accelerate the construction of the new wafer fab. The Cheongju campus has already completed the M11, M12, and M15 NAND flash memory production facilities. The new wafer fab can synergize and enhance efficiency with existing production lines. Meanwhile, the site, power, and water infrastructure are also largely in place. The Cheongju M17 wafer fab has a total construction area of approximately 206,000 pyeong (approximately 680,000 square meters), with construction scheduled to begin in February next year and the first cleanroom to open in December 2028. The investment period will continue until April 2031 and will be implemented in phases according to business progress.
May 20, 2026
43286 workers go on collective strike! Samsung shuts down chip production line ahead of schedule: global storage crisis
On May 17th, it was reported that with only a few days left until the strike began on May 21st, Samsung Electronics' semiconductor production line has initiated a production reduction program ahead of schedule. This strike involves 43286 workers, more than half of the total number of employees in Samsung's semiconductor division (DS department), making it the largest work stoppage since the company's establishment. It is reported that Samsung has entered emergency management mode and gradually reduced production and operation load. In emergency mode, the factory limits the number of new wafers that can be put into the production process, which directly impacts the semiconductor manufacturing process that typically requires 24-hour uninterrupted operation. The strike target production line mainly produces HBM, LPDDR5, and some customized logic chips, which are the core storage components of current AI computing and high-performance devices. Once the semiconductor production line is shut down, the recovery cycle is extremely long. Even if the strike only lasts for 18 days, it will still take two to three weeks to restart the production line and restore stability, which will impact the global supply of storage chips. The expectation of a strike has spread to the spot market. The price of DDR4 8Gb DRAM chips in the Huaqiangbei market in Shenzhen has increased by about 20% this week, and the price of DDR5 RDIMM 64GB modules has risen to $1350. If customers switch to SK Hynix or Micron due to unstable supply, Samsung may face the risk of long-term market share loss. The South Korean government has warned that the losses will be unimaginable and has stated that it is considering all measures, including emergency arbitration.

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Question: How do you ensure the quality of the domestic chips you distribute?

Answer: We work with chip manufacturers that have strict quality control systems in place. All chips undergo multiple rounds of testing at the manufacturing stage, including electrical performance testing, reliability testing, and environmental testing. Before delivery, we also conduct sampling inspections to ensure that the products meet our quality standards. Additionally, we offer a quality guarantee period during which we will handle any quality-related issues promptly.

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Answer: Our domestic chips come with a standard warranty period. During this time, if the chip fails due to manufacturing defects, we will provide free repair or replacement services. The warranty does not cover damages caused by improper use, unauthorized modifications, or external factors such as electrical surges or physical damage. To initiate a warranty claim, please contact our customer service team and provide detailed information about the problem and the chip's serial number.

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Question: How can I ensure a stable supply of your domestic chips, especially during peak demand periods?

Answer: We maintain close partnerships with multiple domestic chip manufacturers. Through long-term cooperation agreements and inventory management strategies, we strive to meet the demand of our customers. We also closely monitor market trends and adjust our procurement plans in advance to ensure a stable supply. In case of unexpected situations, we will promptly communicate with you and provide alternative solutions.

Latest know-How Articles

Blog From 'available' to 'trusted', GigaDevie GSL6188 fingerprint sensor certified by Microsoft ESS

On December 24th, GigaDevie's GSL6188 MoC (Match on Chip) PC fingerprint recognition sensor has successfully passed the Windows Hello Enhanced Sign in Security authentication. This marks that GigaDevie's software and hardware design and system integration capabilities in the field of high security biometric chips have reached international mainstream standards, providing authoritative endorsement for the product to enter the global market. Windows Hello Enhanced Login Security Certification is a hardware security standard established by Microsoft to enhance the overall login security of Windows devices. It requires hardware such as sensors to have high security features and be able to locally isolate and protect biometric data, providing users with a seamless and high-intensity authentication experience. The GigaDevie GSL6188 fingerprint sensor adopts a highly integrated Match on Chip (MoC) architecture, which achieves excellent performance with FRR less than 1.5% and FAR less than 0.002% through dynamic noise reduction algorithm and multi-scale feature fusion algorithm, surpassing the standard requirements of Microsoft Windows Hello for fingerprint recognition. This product has a highly integrated security architecture, built-in independent microcontroller and secure storage, achieving hardware isolation of fingerprint matching and templates, simplifying peripheral design. In terms of security, GSL6188 pre burns certificates during production and supports TPM 2.0 key management and VBS virtualization for isolated operation, ensuring that the fingerprint authentication process runs in a trusted execution environment. In addition, the product also has strong anti-counterfeiting capabilities. With the help of self-developed deep learning algorithms, it can significantly enhance the defense against 2.5D and 3D forged fingerprints. GigaDevie Vice President and General Manager of Sensor Business Unit, Zhi Jun, stated, "The GSL6188 has passed the Windows Hello Enhanced Login Security Certification, which is an important achievement of GigaDevie's long-term technological investment in high-performance and high security biometric sensing. This demonstrates that our product can meet the stringent security requirements of international advanced PC manufacturers. In the future, we will continue to strive to provide more fingerprint biometric solutions, offering high-quality choices that combine security and convenient user experience to the global market.

Blog Striving to be the "game-changer" in China's analog chip industry, Novosense is heading towards the global market

The chip industry continues to develop, and China's path of independent research and development is thriving. Novosense, as a core enterprise in domestic analog chips, is leading the way. Not only has it continuously increased its market share in China, but it has also become a key player in the global supply chain, and together with a group of outstanding Chinese chip companies, it is changing the industry landscape. How can Chinese chip companies grow from scratch to 1, and then from 1 to 10,000? Recently, Yao Di, Vice President of Novosense, stated in a recent external exchange that Novosense's "Rooted in China, Expanding to the World" relies on systematic capabilities. Currently, the company has already deployed some overseas production capacity, providing leading products to the market based on reliability and efficiency. Accuracy, reliability, and response efficiency constitute the "moat" of Novosense The competition in the global analog chip market is essentially a dual contest of "performance + trust". Yao Di believes that Novosense has been able to break through from hundreds of domestic enterprises and become a partner of leading enterprises in the global automotive, industrial, and other fields, primarily because it has built a solid "moat" in three dimensions: precision, reliability, and response efficiency. Accuracy is the "core soul" of analog chips, directly determining the "sensory ability" of electronic systems. Yao Di cited the "gain with speed" function of cars as an example. The analog chip needs to first sense physical signals such as vehicle speed and external noise, transmit them to the central control system, and then send instructions to "increase/decrease volume" to the speaker. In this process, the accuracy and sensitivity of signal conversion directly affect the functional experience. "Just like a hand touching a lit candle will immediately withdraw, if the reaction is 1 second slow, the skin tissue may be burned," the analog chip has extremely high requirements for signal response speed and sensitivity. Novosense has deeply invested in high-precision technology, developing chips capable of accurately converting physical signals into electrical signals. Whether it's voltage acquisition for automotive battery management systems or temperature detection for industrial equipment, these chips can meet customers' stringent accuracy requirements. This is one of the key reasons why many customers choose Novosense for their smart driving system collaborations. Reliability is the "bottom line" for analog chips, especially in long-life scenarios such as automotive and industrial applications, where no compromise is acceptable. Yao Di emphasized that while an automobile may only have 1-2 "brains" (main chips), the number of analog chips can range from hundreds to thousands. "If even one of these analog chips malfunctions, the entire system could potentially break down." Moreover, considering that automobiles typically have a lifespan of 10-20 years, these analog chips must also withstand harsh environments such as high temperatures and high-frequency vibrations in the engine compartment. To this end, Novosense has invested significantly more resources than the industry average to establish a reliability control system: the proportion of quality team members has been maintained at 8%-10% for a long time; in the production process, strategic cooperation has been established with leading global wafer fabs and packaging and testing factories to ensure quality from the source; at the same time, a large number of quality resident teams and engineering resident teams have been stationed in foundries for long-term monitoring of the quality of every production process, including encapsulation and pin extraction. Its automotive-grade chips have passed rigorous testing and demonstrated excellent long-term stability, which is why top-tier wafer fabs choose to deeply collaborate with Novosense. Only a reliable design solution can fully leverage the value of advanced manufacturing processes. 03 Response efficiency is a "differentiating advantage" for Novosense and even Chinese chip companies in global competition. Chinese companies possess a "speed" that overseas giants lack. Yao Di mentioned that Novosense can quickly customize and develop products according to customers' personalized needs. This agility is particularly important in the rapid iteration of the automotive industry. Faced with urgent supply demands, Novosense can efficiently leverage supply chain resources such as wafer fabs and packaging factories, and achieve rapid response through a mature collaborative mechanism. This demonstrates the flexibility of delivery in automotive chip applications and lays the foundation for further deepening cooperation. The analog chip is currently undergoing reliability testing Novosense hot sale part numbers in the global market: NSI8210N0-DSPR NSI8210N1-Q1SPR NSi8120N0/NSI8220N0-DSPR NSi8120N1 NSI8220N1-DSPR NSi8141W1 NSI8241W1-DSWR NSi8141S0 NSi8141S1 NSI8260W0-DSWR NSi8261S1-DSSR NSi8262W0-DSWR NSi8262W1-DSWR NSi8100W NSI1050-DDBR (DUB8) NSI1050-DSWR (SOW16) NCA1042-DSPR NCA1051N-DSPR NSD1025-DSPR NSD1624-DSPR NSi6801TC-DDBR (DUB8) NSI6611ASC-Q1SWR NSI1311-DSWVR NSI1300D05-DSWVR NSi1200-DSWVR NSI1306M25-DSWR

Blog New Product Launch | Chipanalog Microelectronics CA-DV8008 I²C Controlled 8-Channel Low-Side Driver

In the fields of home appliances and industrial control, multi-load drives often face the challenges of limited controller GPIO resources and high system costs. To address this challenge, Chipanalog has officially launched the CA-DV8008—an eight-channel low-side driver controlled by I²C. This device significantly optimizes system resource usage and reduces overall solution costs through an efficient serial-to-parallel control architecture, providing a highly integrated and reliable domestic chip solution for multi-load drive applications. 01 Product Overview The CA-DV8008 is an eight-channel low-side driver controlled by I²C. This device uses a serial interface to parallel output control method, which can significantly save GPIO resources of the main controller, simplify system design, and effectively reduce hardware costs. Each channel supports a sinking current capability of 500mA, the output port withstand voltage is up to 50V, and the built-in clamping diode provides a demagnetizing circuit when inductive loads are turned off. It is suitable for driving various loads such as stepper motors, DC motors, relays, and solenoids. The CA-DV8008 supports a high-speed I²C bus up to 400kHz and has three hardware address configuration pins. It supports up to eight CA-DV8008s connected to the same I²C bus, enabling centralized control of 64 outputs. The SCL and SDA pins use CMOS logic levels, and the logic supply voltage VCC supports a wide input range of 3V to 5.5V, allowing direct connection to 3.3V or 5V microcontrollers and sharing a power supply. The CA-DV8008 is available in SOIC16-NB and TSSOP16 packages, with an ambient operating temperature (TA) range of -40°C to +125°C, meeting the requirements of household appliances and industrial applications. Simplified Circuit Block Diagram 02 Features Eight-channel low-side output, single-channel 500mA sink current capability (25°C, single-channel enable), single-channel 250mA sink current capability (25°C, eight-channel enable, SOIC16-NB package), output port voltage up to 50V, built-in clamping diode for inductive loads, input I²C control, supports clock rates up to 400kHz, SCL/SDA pins CMOS logic level, 3 addressable pins, up to 8 CA-DV800 chips can be connected on the same bus, 8VCC power supply voltage range: 3V~5.5V, ambient operating temperature range: –40°C ~ 125°C, available in SOIC16-NB and TSSOP16 package options. 03 Typical Application Scenarios Motion Control: Stepper motor drive, DC brushed motor drive Power Switches: Relay drive, contactor control, solenoid drive Lighting Systems: Multi-channel LED drive and dimming control Signal Distribution: Line driver, logic buffer and level shifter Home Appliances and Industrial Automation: Multi-channel actuator control, valve drive, electromagnet control The CA-DV8008 can drive two four-phase five-wire stepper motors. The logic-side power supply VCC can share the same power supply as the microcontroller, supporting a supply voltage range of 3V to 5.5V. During use, SCL and SDA need to be pulled up to VCC through resistors. The device address is set by shorting the A2~A0 pins to VCC or GND. The CA-DV8008 integrates a clamping diode, which is connected to the system's high-voltage power supply during application to provide a freewheeling path when the inductive load is turned off. Typical Application Circuit—Driving Stepper Motors The CA-DV8008 can also be used to drive seven-segment or eight-segment common-anode LED digital tubes. Typical Application Circuit—Driving LED Digital Tubes

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