GD32F303CBT6 is a Replacement parts of
STM32F103CBT6/STM32F103C8T6
Mfr.Part No. :
GD32F303CBT6Manufacturer :
GigaDeviceDescription :
Arm® Cortex®-M3 32-bit MCUPackaging :
TRAYPackage :
LQFP-48(7x7)Stock :
in stockPrice :
$0.8-$1.2
GD32F303CBT6
Price: | $0.8-$1.2 | $3.1-$3.5 |
Replace parts:
Replacement parts:
Alternative parts:
Pin to pin parts:
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GD32F303CBT6 |
STM32F103CBT6
STM32F103C8T6
STM32F103CBT6TR
STM32F103C8T6TR
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The GD32F303CBT6 is a 32-bit ARM Cortex-M4 microcontroller that provides higher processing power and better energy efficiency compared to the STM32F103CBT6, which is based on the ARM Cortex-M3 core. The GD32F303CBT6 operates at a maximum clock speed of 108 MHz, compared to the STM32F103CBT6, which runs at 72 MHz. This increased clock speed enables the GD32F303CBT6 to handle more demanding applications, providing faster execution times for real-time operations, signal processing, and data handling.
In addition to the improved clock speed, the GD32F303CBT6 features 256 KB of flash memory and 48 KB of SRAM, which are equivalent or slightly better than the STM32F103CBT6 (which has 128 KB of flash memory and 20 KB of SRAM). This larger memory capacity in the GD32F303CBT6 allows it to support more complex applications and firmware, while offering better memory management and greater flexibility for high-performance systems.
The GD32F303CBT6 also offers enhanced floating-point unit (FPU) support, which is a significant advantage for applications requiring high-precision calculations, such as digital signal processing (DSP) and motor control. In contrast, the STM32F103CBT6 does not include a hardware FPU, which can limit its performance in these applications. The GD32F303CBT6 is thus better equipped for advanced processing tasks, making it a more suitable choice for projects demanding greater computation power.
With the combination of a faster clock speed, better memory architecture, and hardware FPU, the GD32F303CBT6 is ideal for high-performance applications such as industrial control systems, sensor networks, and communication devices that require both speed and computational accuracy.
The STM32F103C8T6 also operates on the ARM Cortex-M3 core but runs at 72 MHz, similar to the STM32F103CBT6. While both chips offer flash memory and SRAM, the GD32F303CBT6 provides 256 KB of flash memory and 48 KB of SRAM, which is notably higher than the STM32F103C8T6 with 64 KB of flash memory and 20 KB of SRAM. This expanded memory capacity in the GD32F303CBT6 makes it much more suitable for applications with higher memory demands, such as data logging, complex algorithms, and multi-threading tasks.
The GD32F303CBT6 also benefits from an improved peripheral set, offering more advanced I/O options, communication interfaces, and PWM channels, making it more adaptable to a variety of embedded applications. The STM32F103C8T6, while well-equipped for general use, offers fewer peripheral options and lacks some of the advanced interfaces that the GD32F303CBT6 supports, such as higher-resolution PWM channels and enhanced communication protocols. This gives the GD32F303CBT6 a competitive edge in complex system designs requiring multiple communication paths, including SPI, I2C, USART, and CAN interfaces.
Additionally, the GD32F303CBT6 comes with enhanced DMA (Direct Memory Access) capabilities, enabling faster data transfer with minimal processor intervention. This results in lower latency and reduced power consumption, which is particularly useful in real-time systems or battery-powered devices. The STM32F103C8T6, with its more basic DMA implementation, may not achieve the same level of performance in similar applications.
By offering more memory, greater peripheral support, and enhanced data transfer features, the GD32F303CBT6 is an ideal choice for projects that demand higher performance, more complex I/O capabilities, and low power consumption.
When comparing power efficiency, the GD32F303CBT6 and STM32F103CBT6 are quite similar, both benefiting from ARM's low-power design principles. However, the GD32F303CBT6 features several optimizations for power management, making it particularly well-suited for battery-powered devices or systems where low-power operation is critical. The STM32F103CBT6 also includes various low-power modes, but it may not achieve the same level of power efficiency in extended operation due to the optimized features available in the GD32F303CBT6.
In terms of cost-effectiveness, the GD32F303CBT6 offers a competitive price point while providing superior performance and memory capabilities. It provides better value for money compared to the STM32F103CBT6, which may require more complex configurations to match the features of the GD32F303CBT6. The cost efficiency and performance per dollar make the GD32F303CBT6 an attractive option for developers seeking both quality and affordability in their embedded system designs.
In conclusion, the GD32F303CBT6 outperforms the STM32F103CBT6 and STM32F103C8T6 in several critical areas, including processing power, memory capacity, and advanced peripheral support. With its Cortex-M4 core running at 108 MHz, the GD32F303CBT6 offers a significant performance boost over the Cortex-M3-based STM32 variants that run at 72 MHz. Additionally, the larger SRAM and flash memory in the GD32F303CBT6 make it a more versatile option for complex applications.
The hardware floating-point unit and advanced peripherals in the GD32F303CBT6 further enhance its suitability for applications requiring high-precision calculations and real-time data processing. Moreover, the chip’s low-power optimization and cost-effectiveness make it an excellent choice for battery-operated and cost-sensitive designs without compromising on performance.
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