GD32F350R8T6 LQFP-64(10x10) Arm® Cortex®-M4 32-bit mcu

GD32F350R8T6 vs. STM32F103R8T6: Performance and Memory Comparison

The GD32F350R8T6 and STM32F103R8T6 are both built on the ARM Cortex-M3 core, which offers solid processing power for many embedded applications. However, the GD32F350R8T6 operates at a higher clock speed of 108 MHz, while the STM32F103R8T6 is clocked at 72 MHz. This higher clock speed of the GD32F350R8T6 directly translates into faster execution times, allowing it to handle more computationally intensive tasks and perform more efficiently in real-time applications.

In terms of memory, the GD32F350R8T6 offers 256 KB Flash and 64 KB SRAM, which is comparable to the STM32F103R8T6's 128 KB Flash and 20 KB SRAM. The GD32F350R8T6's larger memory capacity enables it to handle larger data sets, more complex algorithms, and greater program sizes, making it a superior choice for applications that require significant processing power or larger code bases.

GD32F350R8T6 vs. STM32F205RET6: Peripheral Set and Communication Interfaces

The GD32F350R8T6 and STM32F205RET6 both offer advanced peripheral sets aimed at industrial and commercial applications, but the GD32F350R8T6 stands out with its comprehensive set of communication interfaces. While both chips support CAN, I2C, SPI, and USART, the GD32F350R8T6 offers a more versatile set of timers, PWM outputs, and high-resolution ADCs. This makes the GD32F350R8T6 especially well-suited for sensor interfacing, signal processing, and high-performance control systems that require a wide range of analog and digital signals.

Additionally, the GD32F350R8T6 offers enhanced analog functionality, such as a 12-bit DAC, providing greater flexibility in applications that require high-precision analog output, which is not available in the STM32F205RET6. The STM32F205RET6, while rich in peripherals, lacks the same level of analog integration and multi-functional timers, making the GD32F350R8T6 more flexible in complex, mixed-signal designs.

GD32F350R8T6 vs. STM32F107RCT6: Power Efficiency and Cost Effectiveness

The GD32F350R8T6 is designed with power efficiency in mind, offering advanced low-power modes that optimize energy consumption during idle states. This is particularly beneficial for battery-operated devices and remote sensing applications where low power consumption is critical. While the STM32F107RCT6 also offers low-power capabilities, the GD32F350R8T6 has more aggressive power management options, including a low-power sleep mode, which helps extend battery life without sacrificing performance.

From a cost perspective, the GD32F350R8T6 provides superior performance at a lower cost compared to the STM32F107RCT6, which makes it an excellent choice for cost-sensitive applications. Despite offering a competitive feature set, the STM32F107RCT6 tends to be priced higher, which may be a limiting factor for projects with strict budget constraints.

GD32F350R8T6 vs. STM32F103R8T6 / STM32F205RET6 / STM32F107RCT6: Key Advantages

1. Higher Clock Speed: The GD32F350R8T6 runs at 108 MHz, compared to the STM32F103R8T6’s 72 MHz and the STM32F107RCT6’s 72 MHz. This increase in clock speed allows the GD32F350R8T6 to execute operations more quickly and respond more efficiently in time-sensitive applications.

2. Larger Memory Capacity: The GD32F350R8T6 offers 256 KB Flash and 64 KB SRAM, while the STM32F103R8T6 offers 128 KB Flash and 20 KB SRAM, and the STM32F107RCT6 features 256 KB Flash but only 48 KB SRAM. The larger SRAM capacity in the GD32F350R8T6 ensures smoother handling of larger applications, especially in complex projects where real-time data processing is required.

3. Enhanced Peripheral Set: The GD32F350R8T6 provides a more advanced peripheral set, including 12-bit DAC, high-speed SPI, and multipurpose timers, which are crucial for applications involving sensor interfaces and real-time control systems. The STM32F205RET6, while featuring advanced peripherals, lacks the same level of analog integration and precision found in the GD32F350R8T6, making it a less flexible option for certain mixed-signal applications.

4. Power Efficiency and Cost Effectiveness: The GD32F350R8T6 offers better power efficiency than the STM32F107RCT6, and is more cost-effective than both the STM32F107RCT6 and STM32F205RET6. The GD32F350R8T6’s lower cost, combined with its superior memory and high-performance peripherals, allows manufacturers to achieve a competitive edge while reducing overall system costs.

5. Scalable and Versatile: The GD32F350R8T6 is a highly scalable solution with extended I/O options and a flexible architecture, making it suitable for a wide range of applications, from industrial controls to consumer electronics. The STM32F103R8T6 is a solid choice for less demanding applications but lacks the advanced features and memory of the GD32F350R8T6, while the STM32F205RET6 and STM32F107RCT6 are suited for more specialized high-end applications but come with a higher price tag.

Conclusion

The GD32F350R8T6 offers a clear advantage over the STM32F103R8T6, STM32F205RET6, and STM32F107RCT6 in several key areas, including higher clock speed, larger memory, more advanced peripherals, and better power efficiency. With its 256 KB Flash and 64 KB SRAM, the GD32F350R8T6 can handle larger applications, provide better data throughput, and run more complex algorithms without sacrificing performance. Its advanced peripheral set, including 12-bit DAC and high-precision timers, allows it to excel in mixed-signal applications requiring both analog and digital functionality.

Moreover, the GD32F350R8T6 provides superior cost efficiency while offering better power management and low-power operation, making it ideal for battery-powered systems and remote applications. In comparison, the STM32F103R8T6 and STM32F107RCT6 offer fewer features, while the STM32F205RET6 has strong peripherals but comes at a higher cost.

In conclusion, the GD32F350R8T6 stands out as a high-performance, cost-effective, and energy-efficient solution, making it the preferred choice for embedded systems that require real-time processing, flexible peripherals, and low power consumption.